THERMOELASTIC DELAMINATION OF LAMINATES WITH WEAKLY BONDED LAYERS

A thermoelastic delamination model of laminated plates with weakly bonded layers is developed. Two basic hypotheses to account for interfacial weakly bonding are made. The discontinuity of interfacial displacements is depicted by interfacial constitutive relations, namely the relations between the interfacial displacement jumps and the interfacial transverse stresses. The discontinuity of interfacial temperature is depicted by a thin layer of thermal conduction between two adjacent layers. An empirical formula which accounts for the relation between the interfacial temperature jump and the interfacial normal opening is thus presented to determine interfacial temperature jump. Hence, the thermoelastic solutions of cross-ply laminated plates with weakly bonded layers in cylindrical bending are obtained. The effects of interfacial weakly bonding on the thermoelastic response of laminated plates are exhibited in numerical examples.